SK Hynix has solidified its position as the global market leader after achieving record performance in the High Bandwidth Memory (HBM) market. However, China’s leading memory chipmaker, ChangXin Memory Technologies (CXMT), is catching up at a rapid pace, potentially challenging the iconic Big Three dominance of Samsung, SK Hynix, and Micron.

Empowerment is key to sustainable and resilient development amid radical changes challenging industries worldwide, according to Morris Li, chairman of Teco Electric & Machinery.

Foxconn and Teco Electric and Machinery unveiled a strategic alliance on July 30 via a share swap, combining their expertise in electromechanical systems and ICT to pursue opportunities in the rapidly expanding market for standardized, modular AI data centers.

BOE Technology is on track to surpass LG Display (LGD) as Apple’s top MacBook LCD panel supplier in 2025, marking a significant shift in Apple’s display sourcing as the company edges toward OLED adoption.

MediaTek reported its second-quarter 2025 earnings on July 30, with revenue landing near the top end of guidance and gross margin beating expectations, despite adverse foreign exchange impacts.

As the race for semiconductor architecture dominance reshapes the global tech landscape, former Arm China CEO Allen Wu made a rare appearance at the 5th RISC-V Summit China, declaring RISC-V the future standard for the AI era. Wu’s comments signaled a formal pivot to open-source computing and marked a strategic endorsement of RISC-V by a seasoned industry figure.